SK Hynix announced on the 3rd that it will participate in CES 2025 from January 7 to 10 (local time) in Las Vegas, USA to showcase innovative AI memory technology capabilities. This event will be attended by SK Hynix C-Level management including President and CEO Kwak No-jung, AI Infrastructure President and CMO Kim Ju-sun, and Development General President and CDO An Hyeon. SK Hynix CMO Kim Ju-sun stated "At this CES, we will broadly showcase leading AI memory products including HBM and eSSD as well as solutions optimized for on-device AI and next-generation AI memory" -- emphasizing the aim to widely communicate the company technology competitiveness as a "Full Stack AI Memory Provider." Full Stack AI Memory Provider vision: SK Hynix positioning is not just as an HBM (High Bandwidth Memory) supplier for AI training but as the provider of memory solutions across the entire AI compute stack -- HBM for AI accelerators (training and inference), LPDDR5X for on-device AI in smartphones and PCs, eSSD for AI storage in data centers, and CXL memory for memory pool expansion in AI servers; the "full stack" claim is a strategic statement about where SK Hynix intends to capture value as AI compute diversifies from pure cloud training to edge inference. The HBM market dominance: SK Hynix has approximately 50%+ global HBM market share; NVIDIA H100 and H200 use SK Hynix HBM3 and HBM3E; the CES presentation extends the narrative from "HBM supplier" to "comprehensive AI memory partner" which supports premium pricing justification and deepens customer relationships beyond component procurement.